汽车工程

汽车工程 ›› 2025, Vol. 47 ›› Issue (12): 2420-2430.doi: 10.19562/j.chinasae.qcgc.2025.12.014

• • 上一篇    下一篇

车规级MCU芯片整车匹配试验及其评价方法

张永昌2,1,李兆麟1,2()   

  1. 1.清华大学计算机科学与技术系，北京 100084
    2.北京国家新能源汽车技术创新中心有限公司，国家市场监督管理总局重点实验室（车规芯片测试与评价），北京 100176
  • 收稿日期:2025-03-07 修回日期:2025-05-08 出版日期:2025-12-25 发布日期:2025-12-19
  • 通讯作者: 李兆麟 E-mail:lzl73@mail.tsinghua.edu.cn
  • 基金资助:
    北京市科技计划项目（Z241100004824002）和清华大学苏州专项资助。

Vehicle Matching Test and Its Evaluation Method of Vehicle Grade MCU Chips

Yongchang Zhang2,1,Zhaolin Li1,2()   

  1. 1.Department of Computer Science and Technology，Tsinghua University，Beijing 100084
    2.Beijing National New Energy Vehicle Technology Innovation Center Co. ，Ltd. ，Key Laboratory of Automotive Chip Testing and Evaluation，State Administration for Market Regulation，Beijing 100176
  • Received:2025-03-07 Revised:2025-05-08 Online:2025-12-25 Published:2025-12-19
  • Contact: Zhaolin Li E-mail:lzl73@mail.tsinghua.edu.cn

RichHTML

2

PDF (PC)

33

赞

摘要：

近年来我国汽车芯片产业虽取得长足的进步，但在推动国产汽车芯片上车应用方面仍然面临着巨大挑战。以整车控制器的核心器件——车规级MCU（微控制器）芯片为例，虽然传统的ATE测试能够模拟实车行驶的环境条件来验证芯片的功能、性能及可靠性，但是自主研制的车规级MCU芯片是否匹配实际车辆在复杂行驶条件和恶劣工作环境下的功能、性能、可靠性及功能安全等方面严苛的技术要求，存在技术空白，主要表现为我国缺少车规级MCU芯片的整车匹配试验方法，相关测试系统和实验数据统计分析方法缺失，无法开展车规级MCU芯片在实车行驶工况条件下的整车匹配评价。针对上述问题，本文提出了一种车规级MCU芯片的整车匹配性测试理念和实车试验方法。经试验证明，该试验方法可实现典型车规级MCU芯片的基本功能100%覆盖测试，整车匹配测试设备系统数据采样同步周期小于1 ms，可覆盖整车典型工况下的数据采集周期需求。此外，本文还定义了车规级MCU芯片整车环境测试性能数据的稳定性和一致性，建立了一种基于车规级MCU芯片整车环境测试性能数据的稳定性和一致性评价指标体系，提出了一种集成整车测试数据准备、分析与评价的数据统计分析方法，针对其中的变异系数进行研究并给出推荐值，填补了车规级MCU芯片在实车行驶工况条件下整车匹配评价的技术空白。

关键词: 车规级芯片, MCU芯片, 整车匹配试验方法, 整车匹配测试系统, 数据统计分析方法

Abstract:

Recently， China's automotive chip industry has made significant progress， however promoting the application of domestically produced automotive chips in vehicles faces enormous challenges. Taking the core component of the vehicle controller - vehicle grade MCU （microcontroller unit） chip as an example， although traditional ATE testing can simulate the environmental conditions of real vehicle driving to verify the functionality， performance， and reliability of MCU chips， there is a large technical gap in whether the independently developed vehicle specification level MCU chips meet the strict technical requirements of actual vehicles in complex driving conditions and harsh working environment in terms of functionality， performance， and reliability and functional safety， mainly manifested in the lack of vehicle specification level MCU chips matching test methods in China， the lack of relevant testing systems and experimental data statistical analysis methods， and the inability to carry out vehicle specification level MCU chips matching evaluation under real vehicle driving conditions. For the above problems， in this paper a vehicle compatibility testing concept and actual vehicle testing method for automotive grade MCU chips is proposed. The experiments prove that this testing method can achieve 100% coverage testing of the basic functions of typical automotive grade MCU chips. The data sampling synchronization period of the vehicle matching testing equipment system is less than 1 ms， which can cover the data acquisition cycle requirements under typical vehicle operating conditions. In addition， in this paper the stability and consistency of vehicle grade MCU chips vehicle environment testing performance data is also defined. A stability and consistency evaluation index system based on vehicle grade MCU chips vehicle environment testing performance data is established， and a data statistical analysis method is proposed that integrates vehicle testing data preparation， analysis， and evaluation. The coefficient of variation is studied and recommended values are provided， filling the technical gap in vehicle grade MCU chip matching evaluation under real vehicle driving conditions.

Key words: vehicle grade chips, MCU chips, vehicle matching test method, vehicle matching testing system, data statistical analysis methods